torx1353(f) 2014-05-20 1 fiber optic receiving module torx1353(f) general purpose opti cal receiving module ? data rate: dc to 500 kb / s (nrz code) ? transmission distance: 0.2m to 10 m (using totx1353(f) and apf) ? for jis f05 optical connector ? c-mos interface ? +5v single power supply ? atc (automatic threshold control) circuit is used for stabilized output at a wide range of optical power level. ? low current consumption 1.5 ma (max) (active) 30 a (max) (standby) 1. absolute maximum ratings (ta = 25c) characteristics symbol rating unit storage temperature t stg ? 40 to 95 c operating temperature t opr ? 40 to 85 c supply voltage v cc ? 0.5 to 6 v high level output current i oh ? 1 ma low level output current i ol 20 ma soldering temperature t sol 260 (note 1) c note 1: soldering time 10 s (more than 1 mm apart from the package). using continuously under heavy loads (e.g. the applicatio n of high temperature/current /voltage and the significant change in temperature , etc) may cause this product to de crease in the reliability significantly even if the operating conditions (i.e. operating temperature/ current/ voltage, etc.) are within the absolute maximum ratings and the operating ranges. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). 2. operating ranges characteristics symbol min typ. max unit supply voltage v cc 4.75 5.0 5.25 v data rate dc 500 kb/s high level output current i oh ? 0.8 ma low level output current i ol 0.8 ma start of commercial production 2013 / 02
torx1353(f) 2014-05-20 2 3. electrical and optical characteristics (ta = 25c, vcc = 5 v) characteristics symbol test condition min typ. max unit data rate nrz code(note 2) dc 500 kb / s transmission distance(note5) usi ng apf (note3) and totx1353(f) 0.2 10 m pulse width distortion (note4)(note5) ? tw ? 30 30 % maximum receivable power (note 6) p max dc to 500 kb / s, using apf(note 3) ? 11 dbm minimum receivable power (note 6) p min dc to 500 kb / s, using apf(note 3) ? 23.5 dbm current consumption active (optical flux on) i cc(1) 0.3 1.5 ma standby (no optical flux on) i cc(2) 20 30 a high level output voltage v oh 4.2 4.8 v low level output voltage v ol 0.2 0.4 v note 2: high level output when optical flux is re ceived. low level output when it is not received. note 3: all plastic fiber (980 m core / 1000 m cladding, na=0.5), polished surface. note 4: between input of driver circuit of totx1353(f) and output of torx1353(f). note 5: a value changes with led drive circuits. note 6: ber 10 ? 9 , valued by peak. 4. application circuit 5. applicable optical fiber with fiber optic connectors all plastic fiber (980 m core / 1000 m cladding), na=0.5 f05 type optical connector with polished surface. torx1353(f) soldered to pc board soldered to pc board less than 7mm vcc gnd output (bottom view) 0.1 f fiber optic connector insertion side
torx1353(f) 2014-05-20 3 6. precautions during use (1) absolute ma ximum rating the absolute maximum ratings are the limit values wh ich must not be exceeded during operation of device. none of these rating values must not be exceeded. if the absolute maximum rating value is exceeded, the characteristics of devices may never be recovered properly. in extreme cases, the device may be permanently damages. (2) operating range the operating range is the range of conditions necessary for the device to operate as specified in individual technical datasheets and databooks. care must be exercised in the design of the equipment. if a device is used under conditions t hat do not exceed absolute maximum ratings but exceed the operating range, the specifications related to device operation and electrical characteristics may not be met, resulting in a decrease in reliability. if greater reliability is required, derate the device?s operating ranges for voltage, current, power and temperature before use. (3) soldering optical modules are comprised of internal semiconducto r devices. however, in principle, optical modules are optical components. during soldering, ensure that flux dose not contact with the emitting surface or detecting surface. also ensure that proper flux removal is conducted after soldering. some optical modules come with protective cap. the protective cap is used to avoid malfunction when the optical module is not in use. not that it is not dust or waterproof. as mentioned before, optical modules are optical comp onent. thus, in principle, soldering where there may be flux residue or flux removal after soldering is not recommended. toshiba recommends that soldering be performed without the optical module mounted on the boar d. then, after the board is cleaned, solder the optical module manually. do not perform any further cleaning. if the optical module cannot be soldered manually, use non ? halogen (chlorine ? free) flux and make sure, without cleaning, there is no residue such as chlorine. this is one of the ways to elim inate the effects of flux. in such a case, check the reliability. (4) noise resistance it is believed that the use of optical transfer devices im prove the noise resistance. in principle, optical fiber is not affected by noise. however, especially receiving module which handle signals whose level is extremely small, are comparativel y more susceptible to noise. when using toslink, toshiba recommends that you te st using the actual device and check the noise resistance. use a simple noise filter on the toslink fiber optic receiving module power line. if the ripple in power supply used is high, further reinforce the filter. when locating the optical module in an area susceptible to radiated noise, increase shielding by covering the optical module and the power lin e filter using a metallic cover. (5) vibration and shock this module is resin ? molded construction with wire fixed by resin. this structure is relatively sound against vibration or shock, in actual equipment, there are some cases where vibration, shock, and stress is applied to soldered parts or connected parts, resulting in li ne cut. attention must be pa id to the design of the mechanism for applications which are subj ect to large amounts of vibration. (6) fixing fiber optical receiving module solder the fixed pin (pins 4 and 5) of fiber optic rece iving module torx1353(f) to the printed circuit board to fix the module to the board. (7) solvent when using solvent for flux removal, do not use a high acid or high alkali solvent. be careful not to pour solvent in the optical connector ports. if solvent is inadvertently poured there, clean with cotton tips. (8) protective cap when the fiber optic receiving module torx1353(f) is not in use, use the protective cap.
torx1353(f) 2014-05-20 4 (9) supply voltage use the supply voltage within the operating ranges (v cc = 5 0.25 v). make sure that supply voltage does not exceed theabsolute maximum rating value of 6 v, even instantaneously. (10) output when the receiver output is at low le vel and connected to the power suppl y, or when the output is at high level and connected to gnd, the internal ic may be destroyed. (11) soldering condition solder at 260c or less within ten seconds. (12) an influence of flash or strong light do not emit a flash or a strong li ght to the optical module directly. they may cause an error in data transmission. (13) precaution on waste when discarding devices and packing materials, follow procedures stipulated by local regulations in order to protect the environment against contamination.
torx1353(f) 2014-05-20 5 7. package outline drawing unit: mm pin connection 1.output 2.gnd 3. vcc 4. nc 5. nc 1 2 3 4 5
torx1353(f) 2014-05-20 6 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively "toshiba"), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively "product") without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba's written permission, reproduction is permissible only if reproduction is wit hout alteration/omission. ? though toshiba works continually to improve product's quality a nd reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid sit uations in which a malfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, customers mu st also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specificati ons, the data sheets and application notes for product and the precautions and condi tions set forth in the "toshiba semiconductor reliability handbook" and (b) the instructio ns for the application with which the product will be used with or for. customers are solely responsible for all aspects of their own product design or applications, including but not lim ited to (a) determining the appropriateness of the use of this product in such des ign or applications; (b) evaluating and dete rmining the applicability of any information contained in this document, or in charts, dia grams, programs, algorithms, sample application circuits, or any other refe renced documents; and (c) validating all operating paramete rs for such designs and applications. toshiba assumes no liability for customers' product design or applications. ? product is neither intended nor warranted for use in equipments or systems that require extraordinarily high levels of quality and/or reliability, and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage and/or serious public impact ( " unintended use " ). except for specific appl ications as expressly stated in this document, unintended use includes, without limitation, equipment used in nuclear facilities, equipment us ed in the aerospace industry, medical equipment, equipment used f or automobiles, trains, ships and other transportation, traffic si gnaling equipment, equipment used to control combustions or expl osions, safety devices, elevators and escalators, devices related to electric power, and e quipment used in finance-related fields. if you use product for unintended use, toshiba assumes no liability for product. for details, please contact your toshiba sales representative. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? absent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? 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